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LEAD-FREE TYPE SPECIFICATION
| Spec. | Alloy Composition/WT% | Melting℃ | Particle | Weight | Apply | Characteristic |
| Lead-free low temperature solder paste | Sn42%/Bi58% | 138° | 20-38 micron | 500g/can | LED | Low temperature tin strong solder joint bright |
| Lead-free medium temperature solder paste | Sn64.7Bi35Ag0.3 | 183° | 20-38 micron | 500g/can | High demand product | Lead-free environmental protection, climbing tin strong, even tin less |
| Lead-free medium temperature solder paste | Sn64Bi35Ag1 | 183° | 20-38 micron | 500g/can | High demand product | Lead-free environmental protection, climbing tin strong, even tin less |
| Lead-free high temperature solder paste | Sn99Ag0.3Cu0.7 | 217° | 20-38 micron | 500g/can | High demand product | Lead-free environmental protection, good wettability, climbing tin fast, less tin beads, high reliability |
LEAD TYPE SPECIFICATION
| Spec. | Alloy Composition/WT% | Melting ℃ | Particle | Weight | Apply | Characteristic |
| 55/45-3 # Powder | Sn55% Pb45% | 190° | 25-45 micron | 500g/can | LED bead SMT | LED lights do not shift easily |
| 60/40-3 # Powder | Sn60% Pb40% | 190° | 25-45 micron | 500g/can | LED bead SMT | Solder joint is bright. Shaolian tin |
| 63/37-3 # Powder | Sn63% Pb37% | 183° | 25-45 micron | 500g/can | Normal STM | Strong tin, less tin, bright and full solder joint |
| 63/37-4 # Powder | Sn63% Pb37% | 183° | 20-38 micron | 500g/can | Polypod patch | Particle is small, the tin is strong, the solder joint is bright and full |
| 4 # Powder silver in lead | Sn62.9 Pb36.9 Ag0.2 | 183° | 20-38 micron | 500g/can | QFN mounting | Good wettability, climbing tin fast, less tin beads, high reliability |
| 4 # Powder High rate silver in lead | Sn62.8 Pb36.8 Ag0.4 | 183° | 20-38 micron | 500g/can | BGA chip tinning | Good wettability, strong climbing tin, good electrical conductivity, round and bright solder joints |
Lead-Free Solder Paste: A Comprehensive Overview
Lead-free solder paste is a crucial material in the electronics industry, specifically designed for use in soldering processes that do not involve lead. As environmental regulations and safety standards continue to evolve, the demand for lead-free alternatives has significantly increased, making it an essential component for modern electronic assembly.
Composition
Lead-free solder paste is typically composed of a mixture of tin (Sn) along with various other metals, such as silver (Ag) and copper (Cu). These alloys provide the necessary properties for effective soldering while ensuring compliance with regulations like RoHS (Restriction of Hazardous Substances).
Benefits
- Health and Safety: Lead-free solder paste eliminates the health risks associated with lead exposure, making it a safer option for workers and end consumers.
- Environmental Compliance: Using lead-free solder supports manufacturers in meeting global environmental standards, contributing to sustainability efforts in the electronics industry.
- Improved Performance: Many lead-free solder formulations offer excellent thermal and mechanical properties, ensuring strong and reliable solder joints that withstand demanding operational conditions.
- Versatility: Lead-free solder paste is suitable for a wide range of applications, from consumer electronics to automotive components, and is compatible with various soldering techniques, such as reflow and wave soldering.
Applications
Lead-free solder paste is widely used in the assembly of:
- Printed Circuit Boards (PCBs)
- Surface Mount Technology (SMT) components
- Electronic devices across various industries like telecommunications, automotive, and medical equipment.
Conclusion
In summary, lead-free solder paste has become a vital component in the electronics manufacturing process. Its composition, coupled with the benefits of health and environmental safety, makes it an ideal choice for modern applications. By adopting lead-free solder paste, manufacturers can enhance the reliability of their products while meeting global regulatory standards.
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